what are they comparing the new model against for sound? My launch PS4 was pretty noisy, but my white one is very quite. Seems like there is a lot of variation between individual units so I'd take one measurement with a grain of salt.
All 12xxx are new. The 1TB model they're releasing is a 11xxB, that's why it's the old specs.
Any chance of a PS4 pricedrop soon? Got the money but just waiting for the next drop
This is a duuuuumb question, but is there any reason to wait for this model to show up stateside? If I were to go buy a bundle/system right now, would I regret it in a few months?
All 12xxx are new. The 1TB model they're releasing is a 11xxB, that's why it's the old specs.
is it possible to make 2Gb GDDR5 modules? is samsung planning to do that in the future?
http://www.neogaf.com/forum/showthread.php?t=1075088
Well according to the thread above the stark noise level difference between individual units seem to be caused by how well thermal paste is inserted (this may be only place where personnel at the factory can make difference in such products anyway).
We do know the new unit makes less heat so that should do more benefit than harm at least (they are using exact same fan unit).
Indeed. That's why I suspect the keys never leave the heavily secured and undocumented custom ARM. I mean, the code that runs on that thing is probably audited to hell and back.Remember what happened last time attackers got the hardware keys, psn shutdown for a month and absolute chaos. Whats that compared to a very slightly increased electricity bill for the end user.
I'll trade in everything if they release a PS1 grey PS4 that isn't an anniversary edition. Imagine the light on the console was green? And the coloured PS logo?waiting for the gray slim model to match the anniversary controllers
Next revision is probably a slim next year on a 16nm finfet process.
Yes which makes more sense. This is like a revision 1.1 change where some minor spin revisions of existing chips have been made. There should be a dramatic change in the next hardware revision.
This is a nice start, but I'll be waiting for the inevitable actual "Slim" model to release.
It is 50% less chips but the same number of overall bits. They run at the same rate and same voltage. There will be some overhead for the extra chips, sure, but it would not be that significant.
Not sure I understand your point about bond wires, as this is flip-chip.
Okay,
Flip chip means that solder balls are directly adhered to the chip. In this case, it is true there is no bond wire (the interface between chip and ball is actually a thin layer of copper over parts of the die acting kind of like vias on a mobo)
Looking at the motherboard, not all the chips are flip chip. I certainly spot some QFN devices.
.This is an nice start, but I'll be waiting for the inevitable actual "Slim" model to release.
The new model that Sony's coming out isn't the actual slim model at all, just a slight revision of the original PS4 model.
There are definitely some leaded parts, but I was referring solely to the APU. The padout becomes too numerous to route everything from the edge, from a die route density and bond wire density standpoint.
is it possible to make 2Gb GDDR5 modules? is samsung planning to do that in the future?