Back to the new PS3 4000 chassis. Alert in thread title is because of my wild speculation that follows.
http://www.theverge.com/2012/7/5/3138430/playstation-3-cech-4001x-sony-fcc said:
A pair of debugging stations are also present in the filing, DECH-4001x and DECH-S4001x, suggesting that Sony is putting at least some new hardware through its paces — debugging stations are traditionally used when there's been a change to the chips inside. This could indeed be an all-new slimmer model, but is just as likely to be an internal hardware change as Sony continues to cut the console's cost.
Can we say Die size reduction confirmed? (from 40nm to 32nm)
The following is about 32nm SOI chips being produced for "Gaming" among other uses starting in Dec 2011 at IBM and GF foundries. This is too early and at 32nm not the rumored 28nm for PS4 and Xbox720. My guess is
WiiU as well as Xbox361 or PS3 4000 chassis or both. Charlie at SimiAccurate stated that he heard Oban using this node size and process was being manufactured for Microsoft. He speculated/heard it was for the Xbox720 which NOW does not seem likely. Here are two links speculating on that IBM Dec 2011 5000 wafer production.
http://venturebeat.com/2012/01/25/rumor-control-xbox-720-chips-in-prototype-production/
http://www.fudzilla.com/processors/item/25619-oban-initial-product-run-is-real
And here are News articles that give us information on the Dec 2011 32nm SOI chip production. IBM and AMD/Global Foundries are partnering on design and production.
http://www.globalfoundries.com/newsr.../20120109.aspx
http://www.advancedsubstratenews.com...ibms-32nm-soi/
The press release put SOI front and center, saying, “The technology vastly improves microprocessor performance in multi-core designs and speeds the movement of graphics in gaming, networking, and other image intensive, multi-media applications.” IBM’s 32nm SOI technology was jointly developed with GF and other members of IBM’s Process Development Alliance
The companies' 32/28nm technology uses the same "Gate First" approach to High-k Metal Gate (HKMG) that has reached volume production in GLOBALFOUNDRIES' Fab 1 in Dresden, Germany. This approach to HKMG offers higher performance with a 10-20% cost saving over HKMG solutions offered by other foundries, while still providing the full entitlement of scaling from the 45/40nm node.
The release also notes that the chips rolling off this new line feature IBM’s embedded DRAM (eDRAM). ASN readers will remember that IBM’s eDRAM guru Subu Iyer, wrote in ASN about the role that SOI plays therein back in 2006. He noted that while eDRAMs had previously been done in bulk silicon, “The complexity adder is about half in SOI compared to bulk for deep trench based eDRAMs.”
Interesting, too, that the announcement cites networking, gaming and graphics. IBM, of course, has its own successful SOI foundry business, and owns the high-end gaming market, fabbing SOI-based chips for the big three: Sony PS3, Microsoft Xbox 360 and Nintendo Wii (and the upcoming Wii U).
For its part, GF has all the AMD SOI-based business, including all the Opterons, the FX and the “A-series” APUs – including the upcoming “Trinity” for desktops & high-end laptops, with the new Bulldozer core.
My guess (from reading the articles) is
all on one SOI chip @ 32nm that includes IBM Processors, AMD GPU, AMD Southbridge and eDRAM (larger than 10 megs and not dedicated to GPU?) This is 100% doable with little effort for Xbox360 as the
Xbox360S refresh was already more than half way to this (it had an updated IBM PPC processor and AMD GPU).
An all on one silicon wafer would be cheaper than the Xbox 360S SOC that 2.5D attached eDRAM. The 2010 360S SOC used a newer PPC processor and GPU with custom Southbridge.
Speculation on Xbox refresh (my opinion Dec 2011): Before you dismiss this, read the Xbox360S refresh link above.
I expect a 2012 refresh to use even more updated components that increase efficiency and reduce cost, this includes hardware changes that support DDR3 256 bit buss, UMA, Zero copy, multiple power modes and might include GPU as CPU (all of which would require OS Software changes).
This would actually cost less and use less power. For instance a 256 bit memory buss instead of 128 bit reduces drive power as memory can be run slower and still have the same bandwidth/throughput. If memory is on a multi-layer substrate between the SOC and the Motherboard, costs to implement a 256 bit buss would be minimal with game console volume.
The 360S shows that it's possible to emulate older hardware even after significant changes. The only question is whether the added performance will be allowed to show through and how much Microsoft will fragment the Xbox 360 market. The desktop or dashboard and some OS routines can be made more efficient/faster without impacting game compatibility.
Even without my speculation a new all on one silicon chip refresh for Xbox360 would allow them a price advantage that Sony can not survive if Microsoft decides to press their advantage. A sales downturn is now happening and price drops will happen soon to try to increase sales.
Sony must refresh to allow a cheaper price point for PS3.
For PS3 a refresh to an all on one Silicon chip @ 32nm is not easily possible thus Sony's delay. Dumb PS3 Cell shrink is not possible due to the Flex I/O and Rambuss connectors on either side of the Cell so a total CPU redesign is needed and RSX GPU was not designed to work on SOI.
Speculation PS3 refresh (4000 chassis): Both Xbox and WiiU would be using the most efficient and cost effective design which would be IBM's all on one chip SOC, Sony should do so also if it's possible.
For CPU Sony has already published a patent that indicates they think the current Cell design is dead. Including on a SOI wafer @32 two 1PPU4SPU (Sony 2010 patent) CPU packages with cross bar switch like the Xbox360S or AMD uses in their A series APUs makes sense. Ok we now have no XDR RAM interface or Flex I/O so what do we use?
For GPU if the new PS3 is to be made by IBM or GF as an all on one silicon chip SOC, it appears it would be a AMD GPU as it would support low power modes and is already a SOI process design (likely the same one the Xbox uses). It's either this and software emulation of the RSX or a costly redesign to support low power modes and SOI; software emulation would be cheaper.
If this is what's happening for the PS3 then as far as CPU, everything is in this Chip made for a PS3 to support Xbox360 as Xbox uses one of the PPU processors for OS duties which can be emulated safely by other hardware. Likely the same southbridge and GPU used by the Xbox refresh at 32nm will be in the PS3 SOI wafer also. 256 bit buss memory should be as fast as XDR and 4 64 bit wide 256meg memory chips can give enough extra memory for emulation overhead and a little more for OS features. Again the question is what extra features and performance will Sony allow.
Since both Xbox and PS3 refresh to 32nm on one SOI silicon wafer could be using the same hardware except for the extra SPUs needed for a PS3, one SOI chip @ 32nm design could be used by both. microsoft-sony.com and both get the most cost effective design and share the design and setup costs.
In the above, there could be differences outside the SOC between Xbox361S and PS3S like wireless G for PS3 and Wireless N for Xbox.
If this is happening then WiiU may not be much more powerful than a refreshed PS3 or Xbox would have as potential (maybe not being used), it would just have new APIs and would not have to worry about fragmenting a market.
There is follow-on speculation for both PS4 and Xbox720 using the 1PPU4SPU CPU packages for BC and would refreshed PS3 and Xbox360 @ 32nm be powerful enough for last generation BC.
Anyone see any holes in the above?
http://www.thesixthaxis.com/2012/07/19/sony-detail-2012-gamescom-press-conference/ said:
SONY DETAIL 2012 GAMESCOM PRESS CONFERENCE
It's gonna be a big one. The invite locks down the date as Tuesday 14th August and it’ll be at 7pm local time, at Staatenhaus am Rheinpark, Cologne.
State House on the Rhine Park
THE ARCHITECTURE STRETCHES A STATEMENT ON
. MULTIFUNCTIONAL APPROACH
. MEET AND MARKET PLACE AT THE SAME TIME
. WITH A LIVELY DIALOG IN THE HALLS AND COLONNADES . FUNCTION AND ATMOSPHERE - ROOM FOR SUCCESS
I'd guess, new PS3, new XMB, New OS features, Full browser and more.